All Outputs (2)

Heterogeneous 2.5D integration on through silicon interposer (2015)
Journal Article
Zhang, X., Lin, J. K., Wickramanayaka, S., Zhang, S., Weerasekera, R., Dutta, R., …Kwong, D. L. (2015). Heterogeneous 2.5D integration on through silicon interposer. Applied Physics Reviews, 2(2), 021308. https://doi.org/10.1063/1.4921463

© 2015 AIP Publishing LLC. Driven by the need to reduce the power consumption of mobile devices, and servers/data centers, and yet continue to deliver improved performance and experience by the end consumer of digital data, the semiconductor industry... Read More about Heterogeneous 2.5D integration on through silicon interposer.

Fabrication and assembly of Cu-RDL-based 2.5-D Low-Cost Through Silicon Interposer (LC-TSI) (2015)
Journal Article
Lin, J. K., Chang, K. F., Zhang, S., Yu, L. H., Katti, G., Ho, S. W., …Bhattacharya, S. (2015). Fabrication and assembly of Cu-RDL-based 2.5-D Low-Cost Through Silicon Interposer (LC-TSI). IEEE Design and Test, 32(4), 23-31. https://doi.org/10.1109/MDAT.2015.2424429

A through silicon interposer (TSI) fabrication process and detailed characterization and measurement results of redistribution layers and through silicon vias for low-cost 2.5-D integration is reviewed. Polymer-based Cu-RDL interconnects provide a CM... Read More about Fabrication and assembly of Cu-RDL-based 2.5-D Low-Cost Through Silicon Interposer (LC-TSI).