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Heterogeneous 2.5D integration on through silicon interposer

Zhang, Xiaowu; Lin, Jong Kai; Wickramanayaka, Sunil; Zhang, Songbai; Weerasekera, Roshan; Dutta, Rahul; Chang, Ka Fai; Chui, King Jien; Li, Hong Yu; Wee Ho, David Soon; Ding, Liang; Katti, Guruprasad; Bhattacharya, Suryanarayana; Kwong, Dim Lee

Heterogeneous 2.5D integration on through silicon interposer Thumbnail


Xiaowu Zhang

Jong Kai Lin

Sunil Wickramanayaka

Songbai Zhang

Rahul Dutta

Ka Fai Chang

King Jien Chui

Hong Yu Li

David Soon Wee Ho

Liang Ding

Guruprasad Katti

Suryanarayana Bhattacharya

Dim Lee Kwong


© 2015 AIP Publishing LLC. Driven by the need to reduce the power consumption of mobile devices, and servers/data centers, and yet continue to deliver improved performance and experience by the end consumer of digital data, the semiconductor industry is looking for new technologies for manufacturing integrated circuits (ICs). In this quest, power consumed in transferring data over copper interconnects is a sizeable portion that needs to be addressed now and continuing over the next few decades. 2.5D Through-Si-Interposer (TSI) is a strong candidate to deliver improved performance while consuming lower power than in previous generations of servers/data centers and mobile devices. These low-power/high-performance advantages are realized through achievement of high interconnect densities on the TSI (higher than ever seen on Printed Circuit Boards (PCBs) or organic substrates), and enabling heterogeneous integration on the TSI platform where individual ICs are assembled at close proximity (


Zhang, X., Lin, J. K., Wickramanayaka, S., Zhang, S., Weerasekera, R., Dutta, R., …Kwong, D. L. (2015). Heterogeneous 2.5D integration on through silicon interposer. Applied Physics Reviews, 2(2), 021308.

Journal Article Type Review
Acceptance Date Mar 15, 2015
Online Publication Date Jun 1, 2015
Publication Date Jun 1, 2015
Deposit Date Feb 2, 2017
Publicly Available Date Feb 2, 2017
Journal Applied Physics Reviews
Electronic ISSN 1931-9401
Publisher AIP Publishing
Peer Reviewed Peer Reviewed
Volume 2
Issue 2
Pages 021308
Keywords heterogeneous, 2.5D, integration, silicon, interposer
Public URL
Publisher URL


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