Heterogeneous 2.5D integration on through silicon interposer

Zhang, Xiaowu; Lin, Jong Kai; Wickramanayaka, Sunil; Zhang, Songbai; Weerasekera, Roshan; Dutta, Rahul; Chang, Ka Fai; Chui, King Jien; Li, Hong Yu; Wee Ho, David Soon; Ding, Liang; Katti, Guruprasad; Bhattacharya, Suryanarayana; Kwong, Dim Lee

doi:10.1063/1.4921463

Authors

Xiaowu Zhang

Jong Kai Lin

Sunil Wickramanayaka

Songbai Zhang

Roshan Weerasekera Roshan.Weerasekera@uwe.ac.uk
Senior Lecturer

Rahul Dutta

Ka Fai Chang

King Jien Chui

Hong Yu Li

David Soon Wee Ho

Liang Ding

Guruprasad Katti

Suryanarayana Bhattacharya

Dim Lee Kwong

Abstract

© 2015 AIP Publishing LLC. Driven by the need to reduce the power consumption of mobile devices, and servers/data centers, and yet continue to deliver improved performance and experience by the end consumer of digital data, the semiconductor industry is looking for new technologies for manufacturing integrated circuits (ICs). In this quest, power consumed in transferring data over copper interconnects is a sizeable portion that needs to be addressed now and continuing over the next few decades. 2.5D Through-Si-Interposer (TSI) is a strong candidate to deliver improved performance while consuming lower power than in previous generations of servers/data centers and mobile devices. These low-power/high-performance advantages are realized through achievement of high interconnect densities on the TSI (higher than ever seen on Printed Circuit Boards (PCBs) or organic substrates), and enabling heterogeneous integration on the TSI platform where individual ICs are assembled at close proximity (

Citation

Zhang, X., Lin, J. K., Wickramanayaka, S., Zhang, S., Weerasekera, R., Dutta, R., …Kwong, D. L. (2015). Heterogeneous 2.5D integration on through silicon interposer. Applied Physics Reviews, 2(2), 021308. https://doi.org/10.1063/1.4921463

Journal Article Type	Review
Acceptance Date	Mar 15, 2015
Online Publication Date	Jun 1, 2015
Publication Date	Jun 1, 2015
Journal	Applied Physics Reviews
Electronic ISSN	1931-9401
Publisher	AIP Publishing
Peer Reviewed	Peer Reviewed
Volume	2
Issue	2
Pages	021308
DOI	https://doi.org/10.1063/1.4921463
Keywords	heterogeneous, 2.5D, integration, silicon, interposer
Public URL	https://uwe-repository.worktribe.com/output/832536
Publisher URL	http://dx.doi.org/10.1063/1.4921463