Fabrication and assembly of Cu-RDL-based 2.5-D Low-Cost Through Silicon Interposer (LC-TSI)
(2015)
Journal Article
Lin, J. K., Chang, K. F., Zhang, S., Yu, L. H., Katti, G., Ho, S. W., …Bhattacharya, S. (2015). Fabrication and assembly of Cu-RDL-based 2.5-D Low-Cost Through Silicon Interposer (LC-TSI). IEEE Design and Test, 32(4), 23-31. https://doi.org/10.1109/MDAT.2015.2424429
A through silicon interposer (TSI) fabrication process and detailed characterization and measurement results of redistribution layers and through silicon vias for low-cost 2.5-D integration is reviewed. Polymer-based Cu-RDL interconnects provide a CM... Read More about Fabrication and assembly of Cu-RDL-based 2.5-D Low-Cost Through Silicon Interposer (LC-TSI).