Tensile deformation behavior of Al-Cu 206 cast alloys near the solidus temperature

Chen, X. Grant; Bolouri, Amir

Abstract

© 2017 Trans Tech Publications, Switzerland. To study the micromechanics of semisolid deformation, a modified experimental set-up is employed in Gleeble 3800 thermomechamical testing unit to achieve a uniform temperature distribution in partially remelted aluminum samples. The temperature variation was markedly reduced to one degree for a length of 4-5 mm in the middle of tensile samples. High temperature semisolid tensile tests of Al-Cu 206 cast alloys were performed at different temperatures near solidus with a strain rate of 10-3s-1, corresponding to the solid fractions (fs) between 1 and 0.95. The stress-displacement curves with different fs were measured and analyzed. The microstructure and fracture surface of samples were examined by optical and scanning electron microscopes. The relation between the microstructural characteristics, tensile properties and fracture behavior of semisolid 206 samples at high fs were explored. Mush deformation mechanisms were discussed in term of defect nucleation and propagation at the late stage of solidification.

Citation

Chen, X. G., & Bolouri, A. (2017). Tensile deformation behavior of Al-Cu 206 cast alloys near the solidus temperature. Materials Science Forum, 877, 90-96. https://doi.org/10.4028/www.scientific.net/MSF.877.90

• Journal Article Type: Conference Paper
• Acceptance Date: Sep 1, 2016
• Online Publication Date: Nov 1, 2016
• Publication Date: Jan 1, 2017
• Deposit Date: Sep 8, 2016
• Publicly Available Date: Nov 4, 2016
• Journal: Materials Science Forum
• Print ISSN: 0255-5476
• Publisher: Trans Tech Publications
• Peer Reviewed: Peer Reviewed
• Volume: 877
• Pages: 90-96
• DOI: https://doi.org/10.4028/www.scientific.net/MSF.877.90
• Keywords: Al-Cu 206 alloy, semisolid tensile properties, high temperature deformation, fracture
• Public URL: https://uwe-repository.worktribe.com/output/901272
• Publisher URL: http://dx.doi.org/10.4028/www.scientific.net/MSF.877.90