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Rheoforging of thin case for IT devices with optimal process parameters and new type die design

Jeon, Yong Phil; Bolouri, Amir; Seo, Hyung Yoon; Kim, Jong Deok; Kang, Chung Gil

Authors

Yong Phil Jeon

Amir Bolouri Amir.Bolouri@uwe.ac.uk
Associate Professor in Manufacturing

Hyung Yoon Seo

Jong Deok Kim

Chung Gil Kang



Abstract

The latest trend in the cell phone component industry to use aluminium and magnesium alloys has resulted in the advanced processing technologies. Semi-solid forming process that is advantageous for the mass production of thin parts with complex shapes have been of interest as a promising tool for near net-shape manufacturing. This study describes a semi-solid forming process for the development of a 1 mm-thick cell phone case by using the rheological material prepared by electromagnetic stirring equipment. Thus, a new type of die design for indirect rheoforging was proposed to efficiently control the primary α-Al phase particles in the thin part under rheological conditions. Their microstructure and mechanical properties were investigated and compared to parts produced without electromagnetic stirring. Those products fabricated by electromagnetic stirring had better mechanical properties and globular microstructures than those fabricated without electromagnetic stirring. Several processing parameters such as punch velocity (30 mm/s), punch pressure (75-250 MPa), stirring time (10 s), and solid fraction (0-20%) were used. The optimal condition that resulted in a defect-free component with the improved mechanical properties was explained and discussed. © 2013 IMechE.

Journal Article Type Article
Publication Date Jan 1, 2014
Journal Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science
Print ISSN 0954-4062
Electronic ISSN 2041-2983
Publisher SAGE Publications
Peer Reviewed Peer Reviewed
Volume 228
Issue 6
Pages 1021-1028
APA6 Citation Jeon, Y. P., Bolouri, A., Seo, H. Y., Kim, J. D., & Kang, C. G. (2014). Rheoforging of thin case for IT devices with optimal process parameters and new type die design. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 228(6), 1021-1028. https://doi.org/10.1177/0954406213495768
DOI https://doi.org/10.1177/0954406213495768
Keywords rheology forging die, thin case, electromagnetic stirring
Publisher URL http://dx.doi.org/10.1177/0954406213495768
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