Network formulation and stability improvement of a bilateral teleoperation system with admittance-type master interfaces

Nabeel, Muhammad; Jafari, Aghil; Ryu, Jee Hwan

Abstract

© 2015 IEEE. This paper introduces a network formulation of bilateral teleoperation systems with admittance-type master interfaces to improve their stability range with Time Domain Passivity Approach (TDPA). Since traditional network representation of admittance-type teleoperation was not enough to detect the active energy, a new representation of admittance-type teleoperation system is formulated, using dependent effort/flow concepts. The proposed method, allows choosing small values of inertia in admittance model, which provides high transparency in free space interaction. Using the conventional mechanical-electrical analogy, the teleoperation system is modeled in an electrical network domain. Then, passivity of admittance-type teleoperation is analyzed and the TDPA is applied to passivate the system. Experimental results verified the effectiveness of the proposed approach.

Citation

Nabeel, M., Jafari, A., & Ryu, J. H. (2015). Network formulation and stability improvement of a bilateral teleoperation system with admittance-type master interfaces. https://doi.org/10.1109/AIM.2015.7222796

• Conference Name: IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM
• Acceptance Date: May 13, 2015
• Online Publication Date: Aug 27, 2015
• Publication Date: Aug 25, 2015
• Deposit Date: Sep 4, 2017
• Journal: 2015 IEEE International Conference on Advanced Intelligent Mechatronics (AIM)
• Print ISSN: 2159-6247
• Peer Reviewed: Peer Reviewed
• Volume: 2015-August
• Pages: 1731-1736
• DOI: https://doi.org/10.1109/AIM.2015.7222796
• Keywords: force, stability criteria, admittance, circuit stability, damping, haptic interfaces
• Public URL: https://uwe-repository.worktribe.com/output/834542
• Publisher URL: http://dx.doi.org/10.1109/AIM.2015.7222796
• Additional Information: Title of Conference or Conference Proceedings : IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM 2015)