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Network formulation and stability improvement of a bilateral teleoperation system with admittance-type master interfaces

Nabeel, Muhammad; Jafari, Aghil; Ryu, Jee Hwan

Authors

Muhammad Nabeel

Jee Hwan Ryu



Abstract

© 2015 IEEE. This paper introduces a network formulation of bilateral teleoperation systems with admittance-type master interfaces to improve their stability range with Time Domain Passivity Approach (TDPA). Since traditional network representation of admittance-type teleoperation was not enough to detect the active energy, a new representation of admittance-type teleoperation system is formulated, using dependent effort/flow concepts. The proposed method, allows choosing small values of inertia in admittance model, which provides high transparency in free space interaction. Using the conventional mechanical-electrical analogy, the teleoperation system is modeled in an electrical network domain. Then, passivity of admittance-type teleoperation is analyzed and the TDPA is applied to passivate the system. Experimental results verified the effectiveness of the proposed approach.

Citation

Nabeel, M., Jafari, A., & Ryu, J. H. (2015). Network formulation and stability improvement of a bilateral teleoperation system with admittance-type master interfaces. https://doi.org/10.1109/AIM.2015.7222796

Conference Name IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM
Acceptance Date May 13, 2015
Online Publication Date Aug 27, 2015
Publication Date Aug 25, 2015
Deposit Date Sep 4, 2017
Publicly Available Date Mar 28, 2024
Journal 2015 IEEE International Conference on Advanced Intelligent Mechatronics (AIM)
Print ISSN 2159-6247
Peer Reviewed Peer Reviewed
Volume 2015-August
Pages 1731-1736
DOI https://doi.org/10.1109/AIM.2015.7222796
Keywords force, stability criteria, admittance, circuit stability, damping, haptic interfaces
Public URL https://uwe-repository.worktribe.com/output/834542
Publisher URL http://dx.doi.org/10.1109/AIM.2015.7222796
Additional Information Title of Conference or Conference Proceedings : IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM 2015)