Outputs (3)

Heterogeneous 2.5D integration on through silicon interposer (2015)
Journal Article

© 2015 AIP Publishing LLC. Driven by the need to reduce the power consumption of mobile devices, and servers/data centers, and yet continue to deliver improved performance and experience by the end consumer of digital data, the semiconductor industry... Read More about Heterogeneous 2.5D integration on through silicon interposer.

Fabrication and assembly of Cu-RDL-based 2.5-D Low-Cost Through Silicon Interposer (LC-TSI) (2015)
Journal Article

A through silicon interposer (TSI) fabrication process and detailed characterization and measurement results of redistribution layers and through silicon vias for low-cost 2.5-D integration is reviewed. Polymer-based Cu-RDL interconnects provide a CM... Read More about Fabrication and assembly of Cu-RDL-based 2.5-D Low-Cost Through Silicon Interposer (LC-TSI).

A 9.8 Gbps, 6.5 mW forwarded-clock receiver with phase interpolator and equalized current sampler in 65 nm CMOS (2015)
Presentation / Conference Contribution

© 2015 IEEE. A full-rate energy-efficient forwarded-clock (FC) receiver is demonstrated in this paper. A current sampler with continuous-time equalization is realized with 20 GHz bandwidth in sampling for data recovery. Moreover, a phase interpolator... Read More about A 9.8 Gbps, 6.5 mW forwarded-clock receiver with phase interpolator and equalized current sampler in 65 nm CMOS.