An Analytical Capacitance Model for Through-Silicon Vias in Floating Silicon Substrate
(2016)
Journal Article
© 2016 IEEE. Through-silicon via (TSV) is an integral part of 2.5-D IC technology leveraged for multichip heterogeneous integration to achieve shorter interconnects, faster speed, and lower power consumption in the state-of-the-art circuit systems. T... Read More about An Analytical Capacitance Model for Through-Silicon Vias in Floating Silicon Substrate.