Rheoforging of thin case for IT devices with optimal process parameters and new type die design
(2013)
Journal Article
Jeon, Y. P., Bolouri, A., Seo, H. Y., Kim, J. D., & Kang, C. G. (2014). Rheoforging of thin case for IT devices with optimal process parameters and new type die design. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 228(6), 1021-1028. https://doi.org/10.1177/0954406213495768
The latest trend in the cell phone component industry to use aluminium and magnesium alloys has resulted in the advanced processing technologies. Semi-solid forming process that is advantageous for the mass production of thin parts with complex shape... Read More about Rheoforging of thin case for IT devices with optimal process parameters and new type die design.