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Investigation of transverse residual stresses in a thick pultruded composite using digital image correlation with hole drilling

Yuksel, Onur; Baran, Ismet; Ersoy, Nuri; Akkerman, Remko

Authors

Onur Yuksel

Ismet Baran

Nuri Ersoy Nuri3.Ersoy@uwe.ac.uk
Senior Lecturer in Mechanical Engineering

Remko Akkerman



Abstract

© 2019 Elsevier Ltd Process induced residual stresses are one of the main sources of defects such as (pre) mature matrix cracking during pultrusion of fiber reinforced polymer composite profiles. Recently, comprehensive process models have been developed to understand and describe the underlying mechanisms of the residual stresses in pultrusion processes. The predicted stresses however have not been validated with experimental measurements which are necessary to verify the implemented material models and assumptions in the process models. A hole drilling method with digital image correlation (DIC) is used in the present work to measure the transverse strain relaxation due to material removal in a pultruded thick composite profile (20 × 20 mm) made of unidirectional glass/polyester. The corresponding residual stress state is back calculated using the measured strains in a finite element based numerical model. The estimated level of transverse residual stress in the core of the profile was found to be 6.1 MPa in tension.

Journal Article Type Article
Publication Date Sep 1, 2019
Journal Composite Structures
Print ISSN 0263-8223
Publisher Elsevier
Peer Reviewed Peer Reviewed
Volume 223
Pages 110954
APA6 Citation Yuksel, O., Baran, I., Ersoy, N., & Akkerman, R. (2019). Investigation of transverse residual stresses in a thick pultruded composite using digital image correlation with hole drilling. Composite Structures, 223, 110954. https://doi.org/10.1016/j.compstruct.2019.110954
DOI https://doi.org/10.1016/j.compstruct.2019.110954
Keywords digital image correlation (DIC), residual/internal stress, finite elementanalysis (FEA) ; E. Pultrusion; Hole drilling
Publisher URL https://www.sciencedirect.com/science/article/pii/S026382231930159X
Additional Information Additional Information : This is the author's accepted manuscript. The final published version is available here: https://www.sciencedire...e/pii/S026382231930159X