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Investigation of transverse residual stresses in a thick pultruded composite using digital image correlation with hole drilling

Yuksel, Onur; Baran, Ismet; Ersoy, Nuri; Akkerman, Remko

Authors

Onur Yuksel

Ismet Baran

Nuri Ersoy

Remko Akkerman



Abstract

© 2019 Elsevier Ltd Process induced residual stresses are one of the main sources of defects such as (pre) mature matrix cracking during pultrusion of fiber reinforced polymer composite profiles. Recently, comprehensive process models have been developed to understand and describe the underlying mechanisms of the residual stresses in pultrusion processes. The predicted stresses however have not been validated with experimental measurements which are necessary to verify the implemented material models and assumptions in the process models. A hole drilling method with digital image correlation (DIC) is used in the present work to measure the transverse strain relaxation due to material removal in a pultruded thick composite profile (20 × 20 mm) made of unidirectional glass/polyester. The corresponding residual stress state is back calculated using the measured strains in a finite element based numerical model. The estimated level of transverse residual stress in the core of the profile was found to be 6.1 MPa in tension.

Journal Article Type Article
Acceptance Date May 2, 2019
Online Publication Date May 4, 2019
Publication Date Sep 1, 2019
Deposit Date May 7, 2019
Publicly Available Date May 5, 2020
Journal Composite Structures
Print ISSN 0263-8223
Publisher Elsevier
Peer Reviewed Peer Reviewed
Volume 223
Pages 110954
DOI https://doi.org/10.1016/j.compstruct.2019.110954
Keywords digital image correlation (DIC), residual/internal stress, finite elementanalysis (FEA) ; E. Pultrusion; Hole drilling
Public URL https://uwe-repository.worktribe.com/output/847323
Publisher URL https://www.sciencedirect.com/science/article/pii/S026382231930159X
Additional Information Additional Information : This is the author's accepted manuscript. The final published version is available here: https://www.sciencedirect.com/science/article/pii/S026382231930159X
Contract Date May 7, 2019

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